CIRCUPOSIT™ 3350-1 Electroless Copper (Low Build)
CIRCUPOSIT™ 3350-1 Electroless Copper is an integral part of the Circuposit PTH Low-build Electroless Copper Process. It is designed to provide improved properties and results across a number of different substrates.
Material Features:
- CIRCUPOSIT™ 3350-1 Electroless Copper provides higher quality hole-wall coverage and excellent adhesion
- It provides excellent bath stability and performance
- It can be applied either vertically or horizontally
- Volume growth solution is reduced thanks to its properties
- It offers exceptional Interconnect reliability
- Bath maintenance is minimised
- It has both low- and high-build deposition capabilities
Manufacturer:
