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CIRCUPOSIT™ 3350-1 Electroless Copper (Low Build)

CIRCUPOSIT™ 3350-1 Electroless Copper is an integral part of the Circuposit PTH Low-build Electroless Copper Process. It is designed to provide improved properties and results across a number of different substrates.

Pack Sizes:





Material Features:

  • CIRCUPOSIT™ 3350-1 Electroless Copper provides higher quality hole-wall coverage and excellent adhesion
  • It provides excellent bath stability and performance
  • It can be applied either vertically or horizontally
  • Volume growth solution is reduced thanks to its properties
  • It offers exceptional Interconnect reliability
  • Bath maintenance is minimised
  • It has both low- and high-build deposition capabilities