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MICROFILL™ LVF3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification.

Material Features:

  • Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation
  • The fill works ideally with lower copper surface thickness
  • It offers bright, highly ductile and leveled deposit
  • Operations are simplified via its DC process with insoluble anodes
  • CVS easily controls and analyses proccesses
  • It can be used in both pattern and panel plate applications
  • Its tunable process can be used for certain specific end user requirements