MICROFILL™ LVF3 Acid Copper
MICROFILL™ LVF3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification.
Material Features:
- Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation
- The fill works ideally with lower copper surface thickness
- It offers bright, highly ductile and leveled deposit
- Operations are simplified via its DC process with insoluble anodes
- CVS easily controls and analyses proccesses
- It can be used in both pattern and panel plate applications
- Its tunable process can be used for certain specific end user requirements
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