BPR 100 Photoresist
BPR 100 Photoresist is a liquid, negative-tone photoresist formulated for use in a wide variety of plating and etching processes used in Wafer Level Packaging (WLP) manufacturing.
Pack Sizes and Applications:
US
QUARTS
US
GALLONS
- Wafer Level Packaging (WLP)
- Multiple metal and organic substrates including aluminium, copper, gold, nickel, titanium, chromium, silicon, silicon oxide, glass, ceramic and polyamide
Material Features:
- It can be used on virtually all metal and organic substrates
- Versatile for both plating and etching processes
- Designed to function as a 100-micron, single-spin, bump plating photoresist for Wafer Level Packaging
Manufacturer:
