Ronaclean 201 is a cleaner for dip applications. It can be used as a soak cleaner or electrolytically in anodic or cathodic mode. Ronaclean 201 is a well balanced silicate free mixture of cleaning salts, chelating agents and softeners. The use of the separate wetting agent, Ronaclean 202 Concentrate, and sodium hydroxide makes it possible to compose a range of powerful special purpose cleaning solutions for a variety of applications using the three base products.

Ronaclean 202 is an acidic cleaner free from strong complexing agents and NPE’s. Ronaclean 202 is designed for cleaning sensitive copper surfaces as well as printed circuit boards as the first stage in pattern plating. Ronaclean 202 may be used in conjunction with Ronetch PS (30 g/l) to produce a clean, active copper surface prior to subsequent electroplating in any of the Copper Gleam processes. Ronaclean 202 may also be used as a cleaner/conditioner prior to barrel nickel plating of MLCC’s.

Ronaclean DLF is a high efficiency, heavy duty, low foaming, soak / electro-cleaner, conceived for primary cleaning of steel and copper substrates. The process is suitable for rack, barrel and high - speed applications.

Ronaclean NP 200 is a phosphorous-free/electrolytic cleaning solution with outstanding cleaning efficiency. It is designed for primary cleaning of copper and iron alloy substrates prior to subsequent electroplating operations for various electronic applications.