Nikal PC-2 is an additive designed to reduce internal stress in deposits from Watts or sulphamate
- nickel electrolytes and is therefore especially suitable for use when nickel plating electronic
components including printed circuits and also in electroforming applications. Pitting is controlled
by the addition of wetting agents. The electrolyte may be used in barrel or rack applications.
Nikal PC-2 deposits are particularly suitable as an underplate e.g. with subsequent gold plating.

Nikal PC-3 is a single additive designed to reduce internal stress in Watts or sulfamate nickel
solutions. The deposits produced are bright and ductile with a slight tendency to levelling. The
process can be used in rack, barrel and high speed applications for plating all types of electronic
components e.g. printed circuit boards and connectors, and for electroforming. The deposits
have excellent receptivity to overplating with gold etc.

Nikal PC-4 is a single additive designed to reduce stress in Watts or sulphamate nickel
solutions. The deposits produced are bright and ductile with a tendency to positive levelling. This
process can be used in rack, barrel and high speed applications for plating all types of electronic
components e.g. printed circuit boards, connectors and electroforming. The deposits have
excellent receptivity to overplating with gold etc.

The Nikal PC-5 Additive is designed to reduce internal stress in Watts or sulphamate nickel
solutions. The process can be used for plating of electronic components, including printed circuits,
and also for electroforming and for decorative applications. Pitting is controlled by use of wetting
agents. The solutions are suitable for rack or barrel operation. The deposits have excellent
receptivity to overplating with gold, bright nickel, etc.

Nikal PC8 is a single additive designed to reduce stress in Watts or sulphamate nickel
solutions. The deposits produced are bright and ductile with a tendency to positive levelling. This
process can be used in rack, barrel and high speed applications for plating all types of electronic
components e.g. printed circuit boards, connectors and electroforming. The deposits have
excellent receptivity to overplating with gold etc.

Spectra TGB Barrel Application process produces deposits with the following characteristics:

- Brilliant brightness
- Extremely bright throwing power
- Good ductility
- High degree of levelling

Due to the high degree of levelling and brightness, existing exposition times in the nickel
electrolyte can be reduced considerably (only applicable if the specified coating thickness is still
guaranteed). The resulting economic advantages are: lower nickel consumption, lower energy
costs, higher installation capacity.

Nickel Gleam EP-M is a single additive process designed to produce nickel-phosphorus
deposits from nickel sulphate based electrolytes. The composition of the deposit produced is
dependent on additive content and current density.
Nickel Gleam EP-M can be used for rack, barrel and high-speed applications. Nickel Gleam
EP-M allows phosphorus concentrations in the deposit to reach 11 % P or more. For
applications where maximum ductility plus corrosion resistance is required, a duplex coating of
nickel (Nikal PC-3 or SC) and a thin layer of Nickel Gleam EP-M is recommended.

Nicostan 91 is a tin-nickel process, suitable for both rack and barrel applications.
Advantages:

1. Nicostan 91 produces bright deposits.
2. Nicostan 91 contains ca. 67% tin in the deposit and has very good corrosion
resistance.
3. Nicostan 91 produces a uniform deposit colour and brightness over a wide
current density range (0.1 - 4.0 A/dm2).

Nikal SC produces matte to semi-bright, low porosity nickel deposits in high speed equipment such
as reel-to-reel or cut strip plating machines. Nikal SC is characterised by its ability to produce highly
ductile deposits, making it particularly suitable for semiconductor applications where components
undergo trim and form operations. The use of a nickel activator after the Nikal SC process, such as
Rohm and Haas Acid Activator PC-1, ensures that uniform, adherent deposits will be produced
when over-plating with gold, palladium, or tin/tin-lead on semiconductor components.
Characteristics

1. Ductile, low porosity electrodeposits
2. Effective barrier to base material diffusion
3. Excellent solderability when protected with an appropriate top coating
4. Ease of solution maintenance

Spectra Black facilitates the plating of dark, anthracite coloured nickel deposits. Spectra Black is
suitable for rack and barrel applications. Spectra Black nickel deposits have good abrasion
resistance and offers interesting decorative combinations with gold or bright chrome.

Nickel Gleam BR 220 is a bright nickel plating process. It was developed to meet the high
performance requirements demanded by the bright nickel plater and may be used as the top
layer of a duplex nickel system where maximum corrosion protection of the substrate is
required.

Nickel Gleam SB 200 is a semi-bright nickel plating process. It was developed to meet the undercoat requirements for a duplex nickel deposit, especially where used in the plating on plastics industry.

Spectra LBN99 bright nickel process produces deposits with the following characteristics:

1. High degree of levelling
2. Brilliant brightness
3. High ductility
4. Good chrome plating receptivity

Due to the high degree of levelling and brightness, existing exposition times in the nickel
electrolyte can be reduced considerably (only applicable if the specified coating thickness is still
guaranteed). The resulting economic advantages are: lower nickel consumption, lower energy
costs, higher installation capacity.