Electrolytic Nickels

  • Nikal PC3

    Nikal PC-3 is a single additive designed to reduce internal stress in Watts or sulfamate nickel
    solutions. The deposits produced are bright and ductile with a slight tendency to levelling. The
    process can be used in rack, barrel and high speed applications for plating all types of electronic
    components e.g. printed circuit boards and connectors, and for electroforming. The deposits
    have excellent receptivity to overplating with gold etc.

  • Nikal PC8

    Nikal PC8 is a single additive designed to reduce stress in Watts or sulphamate nickel
    solutions. The deposits produced are bright and ductile with a tendency to positive levelling. This
    process can be used in rack, barrel and high speed applications for plating all types of electronic
    components e.g. printed circuit boards, connectors and electroforming. The deposits have
    excellent receptivity to overplating with gold etc.

  • Spectra TGB

    Spectra TGB Barrel Application process produces deposits with the following characteristics:

    - Brilliant brightness
    - Extremely bright throwing power
    - Good ductility
    - High degree of levelling

    Due to the high degree of levelling and brightness, existing exposition times in the nickel
    electrolyte can be reduced considerably (only applicable if the specified coating thickness is still
    guaranteed). The resulting economic advantages are: lower nickel consumption, lower energy
    costs, higher installation capacity.

  • Nickel Gleam EP-M

    Nickel Gleam EP-M is a single additive process designed to produce nickel-phosphorus
    deposits from nickel sulphate based electrolytes. The composition of the deposit produced is
    dependent on additive content and current density.
    Nickel Gleam EP-M can be used for rack, barrel and high-speed applications. Nickel Gleam
    EP-M allows phosphorus concentrations in the deposit to reach 11 % P or more. For
    applications where maximum ductility plus corrosion resistance is required, a duplex coating of
    nickel (Nikal PC-3 or SC) and a thin layer of Nickel Gleam EP-M is recommended.

  • Nicostan 91

    Nicostan 91 is a tin-nickel process, suitable for both rack and barrel applications.
    Advantages:

    1. Nicostan 91 produces bright deposits.
    2. Nicostan 91 contains ca. 67% tin in the deposit and has very good corrosion
    resistance.
    3. Nicostan 91 produces a uniform deposit colour and brightness over a wide
    current density range (0.1 - 4.0 A/dm2).

  • Nikal SC

    Nikal SC produces matte to semi-bright, low porosity nickel deposits in high speed equipment such
    as reel-to-reel or cut strip plating machines. Nikal SC is characterised by its ability to produce highly
    ductile deposits, making it particularly suitable for semiconductor applications where components
    undergo trim and form operations. The use of a nickel activator after the Nikal SC process, such as
    Rohm and Haas Acid Activator PC-1, ensures that uniform, adherent deposits will be produced
    when over-plating with gold, palladium, or tin/tin-lead on semiconductor components.
    Characteristics

    1. Ductile, low porosity electrodeposits
    2. Effective barrier to base material diffusion
    3. Excellent solderability when protected with an appropriate top coating
    4. Ease of solution maintenance

  • Spectra Black

    Spectra Black facilitates the plating of dark, anthracite coloured nickel deposits. Spectra Black is
    suitable for rack and barrel applications. Spectra Black nickel deposits have good abrasion
    resistance and offers interesting decorative combinations with gold or bright chrome.

  • Nickel Gleam BR 220

    Nickel Gleam BR 220 is a bright nickel plating process. It was developed to meet the high
    performance requirements demanded by the bright nickel plater and may be used as the top
    layer of a duplex nickel system where maximum corrosion protection of the substrate is
    required.

  • Nickel Gleam SB 200

    Nickel Gleam SB 200 is a semi-bright nickel plating process. It was developed to meet the undercoat requirements for a duplex nickel deposit, especially where used in the plating on plastics industry.

  • Spectra LBN 99

    Spectra LBN99 bright nickel process produces deposits with the following characteristics:


    1. High degree of levelling
    2. Brilliant brightness
    3. High ductility
    4. Good chrome plating receptivity


    Due to the high degree of levelling and brightness, existing exposition times in the nickel
    electrolyte can be reduced considerably (only applicable if the specified coating thickness is still
    guaranteed). The resulting economic advantages are: lower nickel consumption, lower energy
    costs, higher installation capacity.