Palladium/ Nickel

  • Pallamet 500

    The PALLAMET™ 500 palladium nickel electroplating process produces bright, ductile palladium-nickel deposits in a plating bath with nearly neutral pH for an environmentally friendly and stable plating operation.

  • Pallamet 600

    Pallamet 600 process is a new generation of Rohm and Haas chloride-free, high speed Palladium-Nickel electroplating process. The reduced ammonia concentration combined with additional ligands incorporated into this new plating solution ensures a stable, environmentally friendly electrolyte and an easy to operate process. Despite the low ammonia content, Pallamet 600 retains all the advantages of the conventional ammonia-based process. The bright Palladium-Nickel deposits of approximately 80 % Pd / 20 % Ni produced from the Pallamet 600 process exhibit low internal stress, excellent ductility and good adhesion to nickel and nickel alloy undercoats. Low porosity and excellent corrosion and wear resistance make the deposits suitable for various electronic applications, when used with a thin flash gold topcoat. The Pallamet 600 process allows the operation at the higher temperature and provides a constant performance over a wide range of current density. The process can be used for reel-toreel applications with differing cell designs of selective plating (e.g. control depth, brush plating, jet plating, spot plating, and etc.).

  • Pallamet Acidic Strike

    PALLAMET™ Acidic Strike is a sulfate-based nickel strike process designed for use prior to
    chloride-free Palladium-Nickel electroplating in order to promote excellent adhesion over
    nickel surfaces, especially bright nickel surfaces. PALLAMET Acidic Strike is suitable for
    continuous high speed selective plating. The acidic media of the strike solution and its cost
    efficiency in comparison with a neutral Palladium-Nickel strike solution are the prime
    benefits of PALLAMET Acidic Strike.