COPPER GLEAM™ HS-200 is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

COPPER GLEAM™ SB-H is a process specifically designed for printed circuit applications in which smooth satin copper deposits are required and high-speed equipment is used, and is particularly designed for use with insoluble anode systems.