MICROFILL™ EVF COPPER VIA FILL is specifically formulated for use with insoluble anodes and direct current (DC) operation, providing enhanced via filling performance with simultaneous through-hole plating. This product can be tuned for both HDI and IC substrate applications, offering superior production flexibility.

MICROFILL™ LVF 3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification. Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation.