Dry Film Photoresist

Company Background:

DJ MicroLaminates is a highly-innovative photoresist materials company that sells a wide range of thick and thin dry film sheets and dry film rolls worldwide.

Key Product Differentiators:

  • DJ MicroLaminates’ Thick film (100µm – 1mm) offers a unique advantage to multilayer microfluidic structures, plating moulds, wafer-level packaging processes, and MEMs
  • DJ MicroLaminates dry films offer structural integrity by way of highly resilient, durable thin and thick film
  • DJ MicroLaminates dry films are eco-friendly, fast, inexpensive, solvent-free, no edge-bead

Photoresist Applications: Dry film photoresist material offers significant advantages in the fabrication of complex, multi-level, high aspect ratio semiconductor electronic and other structures with unique requirements:

  • Electronic Devices – consumer, medical, wireless and other devices
  • Microfluidics Devices – a leading growth application
  • Sensors, MEMS, Wafer Level Packing & Electronic Components

  • ADEX®

    ADEX® is a high performance, chemically amplified, i-line sensitive negative dry film epoxy photoresist offering the user exceptional resolution, aspect ratio, adhesion, and performance.  ADEX is available in 5, 10, 15, 20, 25, 30, 40, 50, and 75µm thicknesses and in roll or sheet format in various shapes and widths up to 250mm.

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  • Thin SUEX® TDFS

    SUEX® TDFS are photo imageable epoxy sheets for plating, wafer-level packaging, and MEMS applications. The sheets consist of a catatonically cured modified epoxy photoresist between two throw-away layers of protective polyester film (PET). The epoxy photoresist formulation contains an antimony-free photoacid generator and is prepared under a highly controlled solvent-less process, which provides uniform coatings. The solvent developed negative working photoresist is sensitive to UV radiation in the range of 350 – 395nm.

     

    SUEX is compatible with and exhibits good adhesion to silicon, silicon nitride, copper, gold, aluminum, glass, polymers, other metals, and oxides.

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  • Thick SUEX® TDFS

    SUEX® TDFS are photo imageable epoxy sheets for plating, wafer-level packaging, and MEMS applications. The sheets consist of a catatonically cured modified epoxy photoresist between two throw-away layers of protective polyester film (PET). The epoxy photoresist formulation contains an antimony-free photoacid generator and is prepared under a highly controlled solvent-less process, which provides uniform coatings. The solvent developed negative working photoresist is sensitive to UV radiation in the range of 350 – 395nm.

     

    SUEX is compatible with and exhibits good adhesion to silicon, silicon nitride, copper, gold, aluminum, glass, polymers, other metals, and oxides.

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