Photoresists
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Positive
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High Resolution
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Negative
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Lift-off
PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from
data storage and wireless ICs, to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and
LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach.
This includes very high-resolution metallization (<0.25 µm), as well as very thick (>3 µm)
metallization. These unique materials are available in a variety of formularies to meet virtually
any customer need. -
DUV Exposure
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E-Beam Resists
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Dielectric
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Bonding Adhesive
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ArF 193nm Photoresists