• Positive

  • High Resolution

  • Negative

  • Lift-off

    PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from
    data storage and wireless ICs, to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and
    LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach.
    This includes very high-resolution metallization (<0.25 µm), as well as very thick (>3 µm)
    metallization. These unique materials are available in a variety of formularies to meet virtually
    any customer need.

  • DUV Exposure

  • E-Beam Resists

  • Dielectric

  • Bonding Adhesive

  • ArF 193nm Photoresists