PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from
data storage and wireless ICs, to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and
LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach.
This includes very high-resolution metallization (<0.25 µm), as well as very thick (>3 µm)
metallization. These unique materials are available in a variety of formularies to meet virtually
any customer need.