PermiNex® 1000 and 2000

Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications


Material Attributes:
i-line imaging, up to 3:1 aspect ratio
Alkaline and solvent developable series
Low temperature processing (< 200⁰C)
High quality, void-free bonding
Excellent adhesion to silicon and glass


Applications:
Definition and capping of cavity structures
BAW and SAW devices
MEMS, MOEMS, microfluidics d

  • PermiNex 1000

    PermiNex 1000 is an epoxy based, photoimageable bonding resist used as a adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices and others, where critical alignment, low temperature processing  and high bond quality are required. PermiNex 1000 is available in four standard viscosities allowing for thicknesses of 1 to >25 micron to be achieved in a single coat.

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  • PermiNex 2000

    PermiNex 2000 is an epoxy based, photoimageable bonding resist used as a adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices and others, where critical alignment, low temperature processing  and high bond quality are required. PermiNex 2000 is available in four standard viscosities allowing for thicknesses of 1 to >25 micron to be achieved in a single coat and is developed in a conventional alkaline developer (TMAH).

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