KMSF® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low stress buffer, passivation or protective layer. It exhibits excellent warpage control especially critical for thin and large diameter substrates used in backend/assembly processing due to its low shrinkage, very low tensile modulus, and low thermal cure requirement. Film thicknesses of ~ 3 to 10 μm can be achieved in a single coat.

KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for high-reliability heterogeneous design in advanced packaging. It provides a unique advantage offering through its improved pattern resolution, low-temperature cure, and robust balance of mechanical and electrical properties. It is designed for an optimal cured film thickness of 5 to 10 μm.