Lift-off
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PMGI/LOR
Lift-off Resists
Metal Deposition Processing
Material Attributes:- Won't intermix when over-coated with most imaging resists
- High thermal stability: Tg ~ 195oC
- Single step development of bi-layer stack in TMAH or KOH developers
- Removes quickly and cleanly in conventional resist strippers
- Enables sub 0.25µm micron bi-layer resist imaging
- Enables high yield, very thick (>3µm) metal lift-off processing
Applications:- Data strage
- III-V Semiconductors
- Optoelectronics