SU-8 Resists
Chemically amplified Epoxy-based Negative Photoresist capable of 0.5 -> 100µm in a single-spin @ 3000rpm
Material Attributes:
i-line processing
High aspect ratio with vertical sidewalls
Photo-definable ultra thick structures
Outstanding thermal and chemical stability
Excellent dry etch resistance
Applications:
Optoelectronics
DRIE etch mask
MEMS
Microfluidics
Displays
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SU-8 TF 6000
High Resolution Thin Negative Epoxy Photoresist
Material Attributes:
Photo-imageable thin films with high resolution i-line patterning capability
Broadband, i-line, g-line and h-line sensitivity
0.5 to > 10 µm film thickness
Highly uniform coatings
Applications:
High resolution imaging of thin permanent structures
MEMS
Display pixel walls and dielectric layers
