Removers and Strippers
MICROPOSIT Remover 1165 is a high-quality Rohm and Haas Electronic Materials product for stripping positive photoresist from sensitive substrates. It requires no intermediate rinse and is fully miscible in water. It can be used in either wet bench or spray tool applications.
REMOVER PG is a proprietary NMP based solvent stripper designed for efficient and complete removal of PMGI, PMMA, SU-8, and other resist films on Si, SiO2, GaAs, and many other substrate surfaces. It may also be used as a lift-off solvent.
- Compatible with automated lift-off equipment
- Clean, scum-free removal
- Universal remover/stripper for removal of all resist films
- Room temperature processing
- No chlorinated or fluorinated hydrocarbons
Remover K is an aqueous-based solution designed for removing KMPR photoresist. It is a two-part chemistry, which is activated prior to use. No dilution is required and the solution is ready to use once activated. Wafers are first processed in Remover PG (NMP), followed by Remover K and the KMPR photoresist completely dissolves away in the final, Neutralizer K rinse.
Nano-Strip® is a stabilized formulation of sulfuric acid and hydrogen peroxide compounds. It removes positive and negative resists and other organic materials used in various applications of semiconductor photolithography. It contains high purity reagents required for high yield semiconductor manufacturing.
ARS-425 remover is an advanced post-ashed residue remover. Developed by Rohm and Haas Electronic Materials, ARS-425 remover is formulated for batch spray tools and batch immersion applications.
No intermediate rinse is required; the remover can be rinsed directly with deionised water.
PRX-127 is a positive photoresist stripper formulation developed by Rohm and Haas Electronic Materials to remove both bulk photoresist and post-plasma-etch residue from advance microelectronic devices. PRX-127 is formulated to provide superior cleaning performance with copper damascene processes, flat panel display applications and magnetic thin film head manufacturing.
Microposit 1112A is an aqueous alkaline remover supplied as a ready to use concentrate or for use in formulating custom dilutions. It is designed to strip photoresist coatings on photomasks, optoelectronic displays, thin film circuits, and other microelectronic devices. For a significant number of applications, the less concentrated Microposit Remover 111A may be desired.
SRX-400 is a high performance formulation developed by Rohm and Haas Electronic Materials to dissolve adhesives used in IC, Thin Film Head and GaAs fabs. SRX-400 de-bonds wafers from sapphire and quartz carriers used in wafer thinning and polishing applications.
SVC-175 is a high performance, non NMP based bulk resist remover developed by Rohm and Haas Electronic Materials for Al architectures. It requires no intermediate rinse and is fully miscible in water. SVC-175 is non flammable. It can be used in either wet bench or batch spray tool applications.
SVC-14 is a highly effective‚ positive photoresist stripper formulation‚ developed by Rohm and Haas Electronic Materials to remove bulk photoresist. SVC-14 is compatible with immersion and spray process tools. This non NMP formulation delivers improved performance on the removing of hard baked, ion implanted, deep UV baked resist and is excellent for metal lift-off. SVC-14 is free from organic acids/bases and ideal for GaAs semiconductors and optoelectronic devices that contain group III-V metals.