NO TARN™ SN-2
NO TARN™ SN-2 is an immersion post-treatment process for packaging technologies that stabilises the surface of electroplated tin deposits without introducing contaminants that may affect solderability.
- NO TARN™ SN-2 is best used for tin to provide unform grain structure
- It reduces formation on oxide layers
- It reduces the risk of heat discolouration after heat treatment