SOLDERON™ BT-280
SOLDERON™ BT-280 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines.
Material Features:
- Its high deposition rates mean that it achieves high throughput values
- Produces high level of brightness and excellent solderability
- It is a low-foaming electrolyte
- The deposits are low-carbon (less than 0.1%) Solderon BT-280 electrolyte offers bright deposit over a wide range of current densities
- Its propriety formulation controls both grain size and grain orientation, resulting in a stable deposit
- The additive system also plates bright SN finish with minimum organic inclusions
- Simple analytical procedures are available for all products in the process
- It achieves consistent and stable surface morphology
- Partial plating and control depth plating are possible thanks to its white foam line
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