A high-speed matte tin/copper alloy electroplating process, Solderon MTC-200 is a low foaming, organic sulfonate electroplating process for the high speed deposition of uniform, fine grain, matte tin/copper alloy coatings.
Solderon MTC-200 is specifically designed for use in high speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector application.
Products Features and Benefits
- Environmetally friendly, lead-free coating
- Low foaming electrolyte
- Uniform deposit appearance
- Excellent solderability
- Minimum whisker formation probability.