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Solderon MTC-200

A high-speed matte tin/copper alloy electroplating process, Solderon MTC-200 is a low foaming, organic sulfonate electroplating process for the high speed deposition of uniform, fine grain, matte tin/copper alloy coatings.

Solderon MTC-200 is specifically designed for use in high speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector application.

Products Features and Benefits

  • Environmetally friendly, lead-free coating
  • Low foaming electrolyte
  • Uniform deposit appearance
  • Excellent solderability
  • Minimum whisker formation probability.