SOLDERON™ ST-200 is a low foaming, organic sulfonate electroplating process for the high and low speed deposition of uniform, large well-polygonised grain tin deposits. It is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility works well with semiconductor lead frame and electronic connector applications.
- Electronic connector
- Its large Grain size helps keep process well polygonised
- It is low stress and offers excellent solderability
- It is a low-foaming electrolyte
- Deposits can be achieved in a uniform, satin-matte appearance