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SOLDERON™ ST-200 is a low foaming, organic sulfonate electroplating process for the high and low speed deposition of uniform, large well-polygonised grain tin deposits. It is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility works well with semiconductor lead frame and electronic connector applications.


  • Semiconductor
  • Lead-frame
  • Electronic connector

Material Features:

  • Its large Grain size helps keep process well polygonised
  • It is low stress and offers excellent solderability
  • It is a low-foaming electrolyte
  • Deposits can be achieved in a uniform, satin-matte appearance