PALLAMERSE™ SMT 2000 PALLADIUM PROCESS
PALLAMERSE™ SMT 2000 PALLADIUM PROCESS is an improved process to coat printed circuit boards with palladium for subsequent SMT assembly applications. It is capable of autocatalytic deposition of palladium-phosphorus coatings on either copper or nickel.
Material Features:
- High deposit thicknesses can be achieved via its autocatalytic process
- Soldermask attack is reduced by working at a low temperature
- Deposits can be bonded with either gold or aluminium wire
- It offers a sable solution with a wide operating window
- It has a consistent deposition range
- Its deposits exhibit excellent solderability
Manufacturer:
