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Release-Conformal Film CMY-190NS

Release-Conformal Film CMY-190NS is a  PBT/TPEE Foil-based product   best suited for the pressure equalization by Lamination of Cover-Layers to Flexible Printed Circuit Boards.


  • Printed circuit boards

Material Features:

  • Release-Conformal Film CMY-190NS acts as an excellent release agent
  • It is silicon free
  • Capable of performing well at temperatures of up to 180°C for 90 minutes
  • It is clean, meaning there is no contamination of its vacuum system
  • When exposed to heat and pressure, it becomes extremely soft for the best conformance to complex flex part topographies
  • It reduces excessive “squeeze-out” and effectively drives adhesive or resin flow into designed areas.