Microposit™ EC Solvent 11
Microposit™ EC Solvent 11 is a solvent designed to eliminate the photoresist edge bead that occurs during typical spin-coat wafer processing.
Material Features:
- By removing the edge bead immediately after photoresist coating, MICROPOSIT EC Solvent 11 reduces the particulate-associated defects caused by subsequent wafer processing
- It can also be used to clean and purge photoresist dispense lines and spinner cup bowls
Manufacturer:
