PermiNex® 1000
PermiNex® 1000 is an epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired. PermiNex® 1000 is available in four standard viscosities allowing film thicknesses of 1 to > 25 μm to be achieved in a single coat.
Pack Sizes and Applications:
500
ml
1
LITRE
4
LITRES
- Definition and capping of cavity structures
- BAW and SAW devices
- MEMS, MOEMS, microfluidics
Material Attributes:
- It has an i-line imaging ratio aspect up to 3:1
- It is an alkaline and solvent-developable series
- Suitable for processing at low temperature (< 200⁰C)
- It offers high quality, void-free bonding
- It provides excellent adhesion to silicon and glass
Manufacturer:
