UV™ III Positive DUV Photoresist is optimized to provide wide process latitude for <0.250 pm in line/space and contact hole applications.
Pack Sizes and Applications:
- Contact hole
- A high activation energy chemical platform is employed, increasing post-exposure delay stability and extending the product’s shelf life.
- It is compatible with 0.26N developer systems
- It can be used with a wide range of substrates including silicon, polysilicon, BPSG and TEOS.