Acids and Bases

CMC Materials offer the broadest line of semiconductor-grade wet chemicals in North America. We also supply major technology customers in Europe, the Middle East and Asia. With purities that extend to the parts-per-trillon (ppt) level, our high-quality acids and bases are used for cleaning formulations and other processes by semiconductor and wafer fabs throughout the world.

By vertically integrating ammonium hydroxide production, nitric acid distillation and hydrofluoric acid generation, we control the entire production process — from assuring raw material quality to final packaging.  This process allows us to evaluate and enhance all processes continuously, so our products can help minimize defects and improve yield.

Acetic Acid

Acetic acid is used in mixed acid etchants and in SEZ etchants. Acetic acid is used in place of water to help keep nitric acid from dissociating, which makes for a more oxidizing solutions.

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  • Acetic Acid Glacial - VLSI
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Hydrochloric Acid

In semiconductor processing, the presence of metallic impurities on the wafer can lead to early dielectric breakdown. Hydrochloric acid is a key ingredient to remove surface metallic ions by forming soluble metal chlorides.

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  • Hydrochloric Acid 36% - VLSI
  • Hydrochloric Acid 37% - VLSI
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Hydrofluoric acid

Hydrofluoric acid is a critical chemistry in semiconductor processing. It is used to solubilize many oxides, particularly silicon dioxide, the most widely used insulator on semiconductor devices.

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  • Hydrofluoric Acid 50:1 - ULSI
  • Hydrofluoric Acid 40% - VLSI
  • Hydrofluoric Acid 50% - ULSI
  • Hydrofluoric Acid 50% - VLSI
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Nitric Acid

Nitric acid is a strong oxidizing agent used to oxidize silicon to silicon dioxide and to dissolve metals to metal nitrates. Nitric acid is used in combination with hydrofluoric acid (HF) in mixed acid etchants to etch silicon.

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  • Nitric Acid Fuming - VLSI
  • Nitric Acid 70% - VLSI
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Phosphoric Acid

Phosphoric acid is used in silicon nitride etching. It is also used in aluminum etch, in which the phosphoric acid acts to dissolve aluminum oxide.

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  • Phosphoric Acid 85% - VLSI
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Potassium Hydroxide

  • Potassium Hydroxide 30% - VLSI
  • Potassium Hydroxide 45% - VLSI
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Sulphuric Acid

Sulphuric acid, our high purity process chemical offering, is used in piranha solutions for organic removal. It is available in bottles, drums, totes and bulk.

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  • Sulphuric Avid 96% - VLSI
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TMAH

  • PRD 238 - VLSI
  • TMAH 25% - VLSI
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