InterVia Photodielectric 8023 has been developed as a layer-to-layer photo-imageable insulation resin to address industry demands, such as redistribution for wafer-level CSPs and solder dam applications. InterVia Photodielectric 8023 is a chemically-amplified negative photoresist that can easily be substituted for conventional materials, such as Polyimide and BCB. Wide processing windows and low-shrinkage during cure eases processing and can lead to improved yields

INTERVIA™ BP DEVELOPER is a metal ion and surfactant-free developer for use with photoresist and photodielectric systems. Its unique functional properties give high process reliability to integrated circuit fabrication.

Aqueous-based, negative-tone photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition

The Intervia 3D-N Developer is specifically designed to be used in conjunction with Intervia 3D-N photoresists in either spray or immersion.

Intervia 3D-N Developer removes unpolymerised Intervia 3D-N photoresist after exposure.

Intervia 3D-N Remover is an aqueous, organic acid based liquid that, when diluted with water, is used to remove Intervia 3D-N photoresist. Intervia 3D-N Remover may be used by immersion, with or without air agitation, or in a pressure spray operation

The Intervia 3D-N Topcoat is an aqueous, non toxic cellulose material designed to improve the handling capabilities of the Intervia 3D-N photoresist. The Intervia 3D-N photoresist is used with electrodeposited and spin-on resists. It prevents resist-coated parts from sticking during exposure and has the effect of "freezing" photoresist coatings in place, therefore, reducing pull back from coated edges.

Intervia 3D-P is electrodeposited from an aqueous emulsion. It is anophoretically deposited onto electrically-conductive substrates regardless of shape or geometric complexity. After coating, the substrate is baked to smooth the film, imaged and developed. After development, the part can be plated with most plating chemistries or etched. After processing the Intervia 3D-P is easily stripped.

Intervia 3D-P Remover is a mixture of organic solvents specifically formulated to remove Intervia 3D-P photoresist. It is particularly recommended for use in applications where the photoresist has seen high temperatures, strong etchants, or other harsh processing conditions. 

INTERVIA™ BP DEVELOPER is a metal ion and surfactant-free developer for use with photoresist and photodielectric systems. Its unique functional properties give high process reliability to integrated circuit fabrication.

INTERVIA™ BP REMOVER is a highly effective photoresist stripper formulation to remove bulk photoresist.

INTERVIA™ BPN PHOTORESIST is a liquid negative-tone photoresist formulated for wafer-level bump plating that can be used on all metal and organic substrates.

NTERVIA™ BPP-10 PHOTORESIST is a general-purpose, multi-wavelength resist designed to cover a wide range of film thicknesses with a single-coat process.