Palladure 150 is an ammoniacal electrolyte producing pure bright, ultra-white palladium deposits which can be used to replace rhodium in decorative applications. Palladure 150 deposits are crack-free up to 0.5 micron and are typically used on bright copper, nickel or silver substrates. The low porosity deposits offer excellent protection against corrosion.

The PALLADURE™ 200 Palladium Electroplating bath is characterized by its ability to
produce semi-bright to bright, crack-free, pure Palladium deposits suitable for Electronic
applications from a mildly alkaline, ammoniacal electrolyte.
Typical applications include Electronic Connectors, Printed Circuit edge tabs and Semi -
conductor components. For Connector applications, the benefits of Palladium coatings can
be enhanced by using a Palladium-Nickel underplate. The Palladium - Nickel/Palladium
composite exhibits exceptional corrosion resistance and ductility. The Palladium/Gold flash
composite exhibits excellent wear resistance and is a suitable replacement for hard Gold.
For Semiconductor components, thin Palladium coatings are suitable as a bondable
surface, replacing Silver on the inner leads and pads of devices, and as a solderable
coating on the external leads, replacing Tin - Lead.

Palladure Strike is an acidic pure palladium strike process designed for use prior to palladium or palladium-nickel plating. The use of Palladure Strike is recommended for nickel and other easily passivated substrates to ensure maximum adhesion of the subsequent palladium deposit. Note that a water rinse after the Palladure Strike is essential prior to subsequent processing.

The PALLAMET™ 500 palladium nickel electroplating process produces bright, ductile palladium-nickel deposits in a plating bath with nearly neutral pH for an environmentally friendly and stable plating operation.

Pallamet 600 process is a new generation of Rohm and Haas chloride-free, high speed Palladium-Nickel electroplating process. The reduced ammonia concentration combined with additional ligands incorporated into this new plating solution ensures a stable, environmentally friendly electrolyte and an easy to operate process. Despite the low ammonia content, Pallamet 600 retains all the advantages of the conventional ammonia-based process. The bright Palladium-Nickel deposits of approximately 80 % Pd / 20 % Ni produced from the Pallamet 600 process exhibit low internal stress, excellent ductility and good adhesion to nickel and nickel alloy undercoats. Low porosity and excellent corrosion and wear resistance make the deposits suitable for various electronic applications, when used with a thin flash gold topcoat. The Pallamet 600 process allows the operation at the higher temperature and provides a constant performance over a wide range of current density. The process can be used for reel-toreel applications with differing cell designs of selective plating (e.g. control depth, brush plating, jet plating, spot plating, and etc.).

PALLAMET™ Acidic Strike is a sulfate-based nickel strike process designed for use prior to
chloride-free Palladium-Nickel electroplating in order to promote excellent adhesion over
nickel surfaces, especially bright nickel surfaces. PALLAMET Acidic Strike is suitable for
continuous high-speed selective plating. The acidic media of the strike solution and its cost
efficiency in comparison with a neutral Palladium-Nickel strike solution are the prime
benefits of PALLAMET Acidic Strike.