Approximately neutral ultra pure gold process (U.S. ASTM Spec. B 488 Type III, Grade A). Designed to reduce gold losses by its high throwing power and avoidance of bare spots when plating multi-lead semi-conductor headers and flat packs. “Fill” use is eliminated. Deposit purity maintained, even in presence of high iron, nickel, cobalt, copper or lead contamination. Suitable for rack and barrel operation.

The Rohm and Haas Auronal BGA (SEA) is a multipurpose, ultra pure gold plating process. Auronal BGA (SEA) produces ductile deposits particularly suitable for die attach and wire bonding applications. Auronal BGA (SEA) is characterised by improved tolerance to metallic impurities and the ability to produce consistently low deposit hardness values. A slightly acidic solution (pH 6.2) helps to preserve dry film integrity.

NIKAL™ PC-5 is an additive designed to reduce stress in Watts or Sulfamate nickel solutions with special reference to plating of electronic components, including printed circuits and electro-forming/decorative parts.

RONOVEL™ CM-97 is a mildly acidic, cobalt-alloyed gold plating process designed to provide bright deposits free of burning at high current densities in electronic finishing applications.

RONOVEL™ N is a mildly acidic, nickel-alloyed gold plating process providing continuous selective plating of electrical contacts with maximum current density, reduced porosity, increased throwing power, and excellent metal distribution.

AUROLECTROLESS SMT Immersion Gold is designed to produce a uniform fine-grained
deposit of soft pure gold on metallic substrates like copper, nickel and palladium. The
plating solution exhibits excellent pH stability and has high tolerance to metallic
contamination. The deposits are solderable and when applied over nickel are also
aluminum wire bondable.

AUROLECTROLESS™ SMT 520 Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. The AUROLECTROLESS™ SMT 520 Immersion Gold bath is easy to control and has high tolerance to contaminants. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.

AUROLECTROLESSTM SMT 525G Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. The AUROLECTROLESS SMT 525G Immersion Gold bath is easy to control and has high tolerance to contaminants. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.

CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

DURAPOSITTM SMT 810 is an electroless nickel system specifically formulated for use in combination with AUROLECTROLESS Immersion Gold. DURAPOSIT SMT 810 combined with AUROLECTROLESS SMT 520 Plating has excellent corrosion resistance and solderability, which is maintained at both high and low bath loading and throughout the solution life. The self-adjusting pH feature simplifies bath operation and makes the process ideal for use with Dow Electronic Materials automatic bath control systems.

Duraposit™ SMT 88 is an electroless nickel system specifically formulated for use in combination with Aurolectroless immersion gold baths. Duraposit SMT 88 produces a bright uniform ENIG deposit on properly prepared PWB substrates.

ELECTROPOSIT™ PC CLEANER is an acidic soak cleaner that is used to clean the copper surfaces of printed circuit boards prior to pattern plating, activating the surfaces as it cleans.

PALLAMERSE™ SMT 2000 PALLADIUM PROCESS is an improved process to coat printed circuit boards with palladium for subsequent SMT assembly applications, and is capable of autocatalytic deposition of palladium-phosphorus coatings on either copper or nickel.

RONACLEAN™ PC 960 is an acid cleaner specifically developed to remove oxidation from copper surfaces after photomech and is effective for all fully-aqueous dry-film systems.

RONAMERSE™ SMT CATALYST CF is a catalyst designed for activation of copper printed circuit boards to ensure that complete and uniform coating of Duraposit SMT 88 is produced, while not coating non-conductive area