Microposit FSC Surface Coating is a non-imageable coating formulated as a protective coating for use during chemical or mechanical processes in microelectronic fabrication. The system has been formulated with a single solvent. It does not contain xylene,acetone or cellosolve acetate

Microposit LOL 1000/2000 Lift-off layer is an enhanced dissolution rate, dyed PMGI solution used for lift-off processes requiring tight CD control, such as GMR thin film head, gallium arsenide, and other leading-edge semiconductor applications. The LOL bilayer lift-off process is suitable for applications where a thin layer of metal is sputtered or evaporated in an additive process. CD variation due to etch bias inherent in subtractive processes is eliminated, resulting in superior metal line width control. Attack on the substrate by the etchant is eliminated.

Microposit 303A Developer is an aqueous alkaline solution. It is suitable for all general microelectronic applications

Microposit 351 Developer is an aqueous alkaline solution for commercially available positive resists such as S1800 Series Photoresist systems. It has been optimised for wafer fabrication and other microelectronic applications for which high speed and resolution are required.

MICROPOSIT MF CD-26 Developer is a 0.26N Surfactant Free product that offers high Photospeed and improved processing latitude for Conventional and Advanced Photoresists. MF CD-26 is effective across various resist technologies including g/h/i line, KrF and ArF. MF CD-26 is a TMAH based Developer designed to be Metal Ion Free to avoid potential sources of Metal Ion Contamination.MF CD-26 works well in Spray, Spray-Puddle, and Immersion processes.

MEGAPOSIT MF-20A series Developers are surfactant containing developers, designed to provide improved process latitude for both conventional and advanced resists over a wide range of developer normalities.

MICROPOSIT MF-300 series Developer has a range of products in the family that offer high photospeed and good processing latitude for high density device fabrication. This TMAH based Developer is compatible with conventional novolac based positive photo resist systems. MICROPOSIT MF-300 series developers are specifically formulated to work with a wide range of Rohm & Haas positive photo resists including MICROPOSIT S1800 and MICROPOSIT SPR3000 series photo resists. If unexposed resist loss (URL) is desired then MICROPOSIT MF-319 should be used. If a higher throughput process is desired MICROPOSIT MF-322 is recommended for use on in-line track systems or immersion processing equipment.

MICROPOSITPrimers are based upon hexamethyldisilizane (HMDS), a well-known chemical pretreatment for increasing photoresist adhesion to doped and undoped oxides, nitride, polysilicon, glass, quartz and other semiconductor surfaces.

ARS-425 remover is an advanced post-ashed residue remover. Developed by Rohm and Haas Electronic Materials, ARS-425 remover is formulated for batch spray tools and batch immersion applications.

No intermediate rinse is required; the remover can be rinsed directly with deionised water

PRX-127 is a positive photoresist stripper formulation developed by Rohm and Haas Electronic Materials to remove both bulk photoresist and post-plasma-etch residue from advance microelectronic devices. PRX-127 is formulated to provide superior cleaning performance with copper damascene processes, flat panel display applications and magnetic thin film head manufacturing.

MICROPOSIT Remover 1165 is a high-quality Rohm and Haas Electronic Materials product for stripping positive photoresist from sensitive substrates. It requires no intermediate rinse and is fully miscible in water. It can be used in either wet bench or spray tool applications

Microposit 1112A is an aqueous alkaline remover supplied as a ready to use concentrate or for use in formulating custom dilutions. It is designed to strip photoresist coatings on photomasks, optoelectronic displays, thin film circuits, and other microelectronic devices. For a significant number of  applications, the less concentrated Microposit Remover 111A may be desired.

SRX-400 is a high performance formulation developed by Rohm and Haas Electronic Materials to dissolve adhesives used in IC, Thin Film Head and GaAs fabs. SRX-400 de-bonds wafers from sapphire and quartz carriers used in wafer thinning and polishing applications

SVC-175 is a high performance, non NMP based bulk resist remover developed by Rohm and Haas Electronic Materials for Al architectures. It requires no intermediate rinse and is fully miscible in water. SVC-175 is non flammable. It can be used in either wet bench or batch spray tool applications.

SVC-14 is a highly effective positive photoresist stripper formulation developed by Rohm and Haas Electronic Materials to remove bulk photoresist. SVC-14 is compatible with immersion and spray process tools. This non NMP formulation delivers improved performance on the removing of hard baked, ion implanted, deep UV baked resist and is excellent for metal lift-off. SVC-14 is free from organic acids/bases and ideal for GaAs semiconductors and optoelectronic devices that contain group III-V metals.

EBR SR-14 is an advanced solvent formulation specifically designed for modern microlithography applications. SR-14 effortlessly removes photo resist edge beads that build up during spin coat wafer processing.

Microposit EC solvent 11 is engineered to eliminate the photoresist edge bead that occurs during typical spin coat wafer processing.

Removing the edge bead immediately after photoresist coating reduces the particulate associated defects caused by subsequent wafer processing.

Microposit EC Solvent 11 can also be used to clean and purge photoresist dispense lines and spinner cup bowls.

Microposit EC Solvent is part of the Microposit Positive Photoresist System and is optimised to satisfy industry requirements in advanced IC device fabrication. It offers significantly reduced health risk over commonly used resist solvent systems.