Eternal/Elga

The major ground for Eternal's constant growth is research and innovation. With the beliefs of “production quality, solid reputation, innovation and service”, we have been dedicating our efforts to technological development and promotion, with greater quality production, to carry out the principle of sustainable growth and techniques for continually offering benefits to the public.

On March 9th, 2017 Eternal Materials Co.,Ltd, already a minority shareholder of Elga Europe s.r.l, took over the majority shareholding.
Mr. Giorgio Favini assumed the role of CEO (chief executive officer) and shareholder of the company.
The acquisition helped strengthen the company and the production of dry film in Europe.

Dry Film

  • Laminar 8000 series

    LAMINAR® E8000 DRY FILM PHOTOPOLYMER is a negative working aqueous resist designed for print & etch, tent & etch and pattern plate applications in the production of printed circuit boards (PCB’S).

  • Laminar 9000 series

    LAMINAR® E9000 DRY FILM PHOTORESIST is a negative working aqueous processable dry film photo resist specifically formulated for acid print & etch and photo-chemical milling applications.

  • Laminar 9200 series

    LAMINAR® E9200 DRY FILM PHOTOPOLYMER is a negative working aqueous resist designed for print & etch, tent & etch and pattern plate applications in the production of printed circuit boards (PCB’S).

  • Laminar UD 900 series

    LAMINAR® UD900 DRY FILM PHOTOPOLYMER is a negative working aqueous resist specifically designed for UV laser direct imaging (LDI) applications. LAMINAR® UD900 has been formulated for acid etching in the production of Inner layers for printed circuit boards (PCB’S) and also photo chemical milling applications. In addition the product is suitable for pattern plate applications on electroless and electroplated copper.

  • ETERTEC® HQ6500 DRY FILM PHOTORESIST.DOC

    ETERTEC® HQ6500 DRY FILM PHOTORESIST

  • ETERTEC® PR8200Y1 PHOTO-IMAGEABLE COVERLAY.pdf

    ETERTEC® PR8200Y1 PHOTO-IMAGEABLE COVERLAY

  • PRODUCT_DATA_SHEET_AM400.PDF

    Ordyl AM 400 is a negative, aqueous processable dry film specifically designed to be exposed with 405 nm wavelength sources.
    AM 400 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl AM 400 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness

  • PRODUCT_DATA_SHEET_AM900.PDF

    Ordyl AM 900 is a negative, aqueous processable dry film designed to be exposed with 405 nm wavelength or double wavelength systems (when one is 405 nm) and standard UV sources.
    Ordyl AM 900 is a negative, aqueous process able dry film designed to be exposed both with sources at 405 nm wavelength, double wavelength systems (when one is 405 nm) and standard UV sources.
    AM 900 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl AM 900 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_AF200E.PDF

    Ordyl AF 200E is a negative, aqueous processable dry film specifically designed for chemical milling application to be exposed with standard UV lamps.
    AF 200E is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to extreme conditions of use in strongly acid solutions.
    Ordyl AF 200E has excellent adhesion on stainless steel and the most common metallic alloys.

  • PRODUCT_DATA_SHEET_NE500.PDF

    Ordyl NE 500 is a negative, aqueous processable dry film specifically designed for ENIG and chemical milling application to be exposed with standard UV lamps.
    NE 500 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to extreme conditions of use in strongly acid solutions.
    Ordyl NE 500 has good flexibility and high adhesion on copper, stainless steel and the most common metallic alloys.

  • PRODUCT_DATA_SHEET_ALPHA300.PDF

    Ordyl Alpha 300 is a negative, aqueous dry film specifically designed to have extremely high resistance in alkaline solutions and galvanic Nickel/Gold. It can be exposed both with LDI and standard UV lamps.
    Alpha 300 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl Alpha 300 guarantee good adhesion on copper surface. This type of dry film has a good flexibility and ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_ALPHA800.PDF

    Ordyl Alpha 800 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.
    Alpha 800 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline solutions. It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB
    manufacturing.
    Ordyl Alpha 800 is particularly recommended for innerlayers thanks to excellent developing properties that leaves the copper surface very clean and ready for the black oxide process. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_ALPHA900.PDF

    Ordyl Alpha 900 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.
    Alpha 900 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline solutions. It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB
    manufacturing.
    Ordyl Alpha 900 guarantee very good adhesion on copper surface. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_AM100.PDF

    Ordyl AM 100 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
    AM 100 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl AM 100 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_AR200S.PDF

    Ordyl AR 200S is a negative, aqueous processable dry film designed to be exposed with UV and LDI exposure machine.
    AR 200S is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl AR 200S has good adhesion on copper surface and for this reason is indicated for direct plating process.
    This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_ALPHA900NDI.PDF

    Ordyl Alpha 900NDI is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
    Alpha 900NDI is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl Alpha 900NDI guarantee very good adhesion on copper surface thanks to a combination of particular photoinitiator and adhesion promoter. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness

  • PRODUCT_DATA_SHEET_AM100DI.PDF

    Ordyl AM 100DI is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
    AM 100DI is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl AM 100DI has strong adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling
    holes; this can be achieved starting from 40 µm thickness

  • PRODUCT_DATA_SHEET_P50000.PDF

    Ordyl P50000 is a negative, aqueous processable dry film designed to be exposed with standard UV lamps and usable also with LDI.
    Ordyl P50000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl P50000 is available in minimum thickness of 100 µm to avoid double lamination of standard dry film. It is indicated for direct plating process where high thickness depositions are required thanks to the excellent through-cure polymerization due to special photoinitiator system.

  • PRODUCT_DATA_SHEET_SY300.PDF

    Ordyl SY 300 is a solvent type permanent dry film for special MEMS applications.
    The Ordyl SY 300 in connection with his auxiliary product line CFC free: Ordyl SY Developer and Ordyl SY Rinse, offer the following performances:

    • Excellent resolution

    • Excellent heat resistance

    • Excellent chemical resistance

    • High stability

    • Biocompatibility

    Ordyl SY 300 could be used for sealing application, due to the capability to be pressed together with a top plate.

  • PRODUCT_DATA_SHEET_FP400.PDF

    Ordyl FP 400 is a negative, aqueous processable dry film designed to be exposed with LDI and standard UV lamps.
    FP 400 is a special Dry Film specifically designed to obtain Ultra-Fine Line pattern.
    FP 400 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing. This type of dry film ensure good tenting
    performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • PRODUCT_DATA_SHEET_ELGA_WET_RESIST_LR_3600H.PDF

    Elga Wet resist LR 3600H is a blue colour, negative-working, UV imageable liquid photo polymer.
    It is designed for Horizontal Type Gravure Roller Coater in mass production of fine line PCBs.
    Elga Wet resist LR 3600H is applicable to acidic etching process.

    MAIN FEATURES
    • Excellent resolution
    • Excellent adhesion and conformability
    • Wider operation window in development
    • High image contrast
    • Easy stripping
    • Good chemical resistance
    • Good for board stacking

  • PRODUCT_DATA_SHEET_FLR_1000.pdf

    Ordyl FLR 1000 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
    FLR 1000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
    Ordyl FLR 1000 has strong adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

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