LAMINAR® E8000 DRY FILM PHOTOPOLYMER is a negative working aqueous resist designed for print & etch, tent & etch and pattern plate applications in the production of printed circuit boards (PCB’S).

LAMINAR® E9000 DRY FILM PHOTORESIST is a negative working aqueous processable dry film photo resist specifically formulated for acid print & etch and photo-chemical milling applications.

LAMINAR® UD900 DRY FILM PHOTOPOLYMER is a negative working aqueous resist specifically designed for UV laser direct imaging (LDI) applications. LAMINAR® UD900 has been formulated for acid etching in the production of Inner layers for printed circuit boards (PCB’S) and also photo chemical milling applications. In addition the product is suitable for pattern plate applications on electroless and electroplated copper.

Ordyl AM 900 is a negative, aqueous processable dry film designed to be exposed with 405 nm wavelength or double wavelength systems (when one is 405 nm) and standard UV sources.
Ordyl AM 900 is a negative, aqueous process able dry film designed to be exposed both with sources at 405 nm wavelength, double wavelength systems (when one is 405 nm) and standard UV sources.
AM 900 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl AM 900 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

Ordyl AF 200E is a negative, aqueous processable dry film specifically designed for chemical milling application to be exposed with standard UV lamps.
AF 200E is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to extreme conditions of use in strongly acid solutions.
Ordyl AF 200E has excellent adhesion on stainless steel and the most common metallic alloys.

Ordyl Alpha 300 is a negative, aqueous dry film specifically designed to have extremely high resistance in alkaline solutions and galvanic Nickel/Gold. It can be exposed both with LDI and standard UV lamps.
Alpha 300 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl Alpha 300 guarantee good adhesion on copper surface. This type of dry film has a good flexibility and ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

Ordyl Alpha 800 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.
Alpha 800 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline solutions. It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB
manufacturing.
Ordyl Alpha 800 is particularly recommended for innerlayers thanks to excellent developing properties that leaves the copper surface very clean and ready for the black oxide process. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

Ordyl Alpha 900 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.
Alpha 900 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline solutions. It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB
manufacturing.
Ordyl Alpha 900 guarantee very good adhesion on copper surface. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

Ordyl AM 100 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
AM 100 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl AM 100 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

Ordyl AM 100DI is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
AM 100DI is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl AM 100DI has strong adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling
holes; this can be achieved starting from 40 µm thickness

Ordyl P50000 is a negative, aqueous processable dry film designed to be exposed with standard UV lamps and usable also with LDI.
Ordyl P50000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl P50000 is available in minimum thickness of 100 µm to avoid double lamination of standard dry film. It is indicated for direct plating process where high thickness depositions are required thanks to the excellent through-cure polymerization due to special photoinitiator system.

Ordyl FP 400 is a negative, aqueous processable dry film designed to be exposed with LDI and standard UV lamps.
FP 400 is a special Dry Film specifically designed to obtain Ultra-Fine Line pattern.
FP 400 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing. This type of dry film ensure good tenting
performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

Elga Wet resist LR 3600H is a blue colour, negative-working, UV imageable liquid photo polymer.
It is designed for Horizontal Type Gravure Roller Coater in mass production of fine line PCBs.
Elga Wet resist LR 3600H is applicable to acidic etching process.

MAIN FEATURES
• Excellent resolution
• Excellent adhesion and conformability
• Wider operation window in development
• High image contrast
• Easy stripping
• Good chemical resistance
• Good for board stacking

Ordyl FLR 1000 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
FLR 1000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl FLR 1000 has strong adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Ordyl FLR 4000 is a negative, aqueous processable dry film specifically designed to be exposed with LDI or standard UV lamps.
FLR 4000 is developable and strippable in mildly alkaline solutions and offers superior performance and resistance to leaching in all of the most commonly used plating solutions in PCB manufacturing.
Ordyl FLR 4000 has good adhesion on the copper surface, so it is recommended for direct plating processes where surface preparation is not good. This type of dry film ensures good tenting performances even on large tooling holes, starting from 40 μm thickness.