EBR PG is specifically formulated to quickly and cleanly remove edge beads that build-up during the spin coat process. Edge bead removal is performed immediately after spin coat by directing a stream of EBR PG near the edge of the wafer while it is spinning. The edge bead remover nozzle can be positioned near the wafer’s edge to dispense EBR PG from the top or from the backside/bottom. By controlling spin speed, nozzle position, and nozzle direction, the resist edge bead is removed. It is important during edge bead removal that the backside of the wafer/substrate not be contaminated with resist from the front. By choosing a spin speed appropriate for the size of the wafer, the resulting centrifugal force prevents this problem.

Benefits

• Permits use of single universal edge bead remover
• Low dispense volumes and reduced disposal costs
• Excellent for spin bowl and equipment clean up

• PMGI & LOR
• PMMA & copolymer
• SU-8
• g-line, i-line and DUV resists

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