Photoimageable Wafer Bonding Adhesives for Permanent and Nonhermetic Applications

Material attributes:
• Negative tone, photoimageable resists
• Alkaline and solvent developable series
• i-line imaging, up to 3:1 aspect ratio
• Low temperature processing (< 200⁰C)
• High quality, void-free bonding
• Excellent adhesion to silicon and glass

Applications:
• Definition and capping of cavity structures
• BAW and SAW devices
• MEMS, MOEMS, microfluidics devices

Resolution Capability

5µm features in 15µm thick PermiNex® 1000
Source: Kayaku Advanced Materials

Bonding Capability

Test cavity structures  Adhesive cavity wall

Si to Glass bonded wafers, 10µm thick PermiNex® adhesive structure
Source: Kayaku Advanced Materials