PermiNex® 1000 and 2000 resist series
Photoimageable Wafer Bonding Adhesives for Permanent and Nonhermetic Applications
Material attributes:
• Negative tone, photoimageable resists
• Alkaline and solvent developable series
• i-line imaging, up to 3:1 aspect ratio
• Low temperature processing (< 200⁰C)
• High quality, void-free bonding
• Excellent adhesion to silicon and glass
Applications:
• Definition and capping of cavity structures
• BAW and SAW devices
• MEMS, MOEMS, microfluidics devices
Resolution Capability
5µm features in 15µm thick PermiNex® 1000
Source: Kayaku Advanced Materials
Bonding Capability
Test cavity structures Adhesive cavity wall
Si to Glass bonded wafers, 10µm thick PermiNex® adhesive structure
Source: Kayaku Advanced Materials