Crownclad 2000 is not only an advanced series of acid gold electrolytes, but also a new approach to the requirements of  decorative platers (jewellery, watches, spectacles, lighters, gift articles, furniture, etc.).

"Mix N' Match", the slogan intentionally created for this new family of Metalor Technologies gold solutions, means a great versatility of colour and allows the user to choose from a wide range of colours, based on the Swiss standards, from white to deep yellow gold.

Engold Strike has been formulated to be compatible with both Engold technical gold and Crownclad 2000
decorative gold processes. The use of a gold strike prior to gold plating offers additional protection against carry-over of contamination, thus extending the main gold bath life, and improving adhesion by reactivation of nickel underplates.

MetGold Strike has been formulated to be compatible with both MetGold technical gold and MetClad 2000 decorative gold processes. Use of a gold strike prior to gold plating offers additional protection against carry-over of contamination, thus extending main gold bath life, and improving adhesion by reactivation of nickel underplates.

A bright palladium process, specifically designed for flash plating.

MetSil 150 bright silver plating solution produces mirror bright, haze-free deposits with excellent throwing power and is for use in either vat or barrel installations. The electrical conductivity of MetSil 150 deposits is similar to that
of pure silver, making it ideal for electronic applications.

MetSil 500CNF is an innovative totally cyanide-free silver plating process that produces bright to semi-bright ductile pure silver deposits up to 25 microns thickness, with excellent throwing power enabling good coverage into difficult to plate recessed areas. MetSil 500CNF contains zero cyanide offering significant environmental health and safety benefits. MetSil 500CNF generates cost savings by elimination of the significant, and increasing, costs of toxic material control that are necessary with cyanide processes. MetSil 500CNF is suitable for both rack and barrel plating and can be used in a wide variety of applications.

The MetGold ECF33B process is designed to produce 99.9 % pure gold deposits with excellent uniformity, low hardness, lemon yellow colour and a matt appearance. MetGold ECF33B can operate at low temperatures. Due to improved solution stability, low hardness can be achieved and there is no resist attack at high speed.
MetGold ECF33B is a weakly alkaline and cyanide-free process, making it applicable for fine pattern line plating on printed circuit boards and for bump plating on silicon wafers where a photoresist is applied. MetGold ECF33B is suitable for positive photoresist because there is no resist attack.

MetGold Pure ATF Strike is a pure gold strike plating process designed for use with the MetGold Pure ATF series. It has zero arsenic and zero thallium in the formulation.
The process has been developed to comply with REACH regulations which will restrict the use of both arsenic and thallium chemicals in the future.

MetGold Pure ATF is a pure gold plating process for microelectronic applications with zero arsenic and zero thallium in the formulation, but maintains all the properties required of such pure gold deposits.
The process has been developed to comply with REACH regulations which will restrict the use of both arsenic and thallium chemicals in the future.

MICROFAB Cu500 is a copper sulfate electroplating process designed for via filling. MICROFAB Cu500 yields a high-reliable deposit with a bright appearance and can be used for patterning on wafers and bump formation.

MICROFAB EL20 is an alkaline etching agent for aluminium electrodes of semiconductor devices MICROFAB EL20 is capable of forming a flat and uniform plating film on aluminium electrodes

MICROFAB ELN240 is a lead-free, electroless nickel-phosphorous plating process designed to selectively deposit a layer on an electrode placed on substrates of semiconductor devices. With its capability of producing uniform deposits with less variation of phosphorous content rate, MICROFAB ELN240 is best suited for base layer formation under electroless palladium or electroless gold plating. MICROFAB ELN240 can be used continuously for periodic replenishment.

MICROFAB ZC300 is an immersion type zincate process that is specially designed for double zincate processing to apply electroless plating on aluminium alloy electrodes of semiconductor wafers.

MICROFAB ZC300 is an alkaline solution but able to prevent excessive corrosion on aluminium alloy, which leads to excellent adhesion of subsequent electroless plating film. The solution can be used consecutively by periodic replenishment.