Solderon BTD is a non-foaming electroplating process for high speed deposition of bright to semi-bright tin and tin/lead alloys from a non-fluoborate electrolyte.
The process is distinguished by its high cathode efficiency and non-foaming character, which minimizes the problem of poor definition caused by stable cathodic foam in controlled depth cell electro deposition.
Solderon BTD is designed for use in high speed reel-to-reel selective electroplating of connector components. The 90/10 tin-lead alloy system offers the most versatility with respect to the influence of cell design on bright tin-lead alloy electro-deposition.
Deposits produced from the Solderon BTD process exhibit exceptional solderability performance, and meet or exceed Military Specification 202F.