SUEX® TDFS are photo-imageable epoxy sheets for plating, wafer-level packaging and MEMS applications. The sheets consist of a catatonically cured modified epoxy photoresist between two throw-away layers of protective polyester film (PET). The epoxy photoresist formulation contains an antimony-free photoacid generator and is prepared under a highly controlled solvent-less process, which provides uniform coatings. The solvent developed negative working photoresist is sensitive to UV radiation in the range of 350 – 395nm.
SUEX is compatible with and exhibits good adhesion to silicon, silicon nitride, copper, gold, aluminium, glass, polymers, other metals and oxides.
Product Features:
SUEX® TDFS are photo-imageable epoxy sheets for plating, wafer-level packaging and MEMS applications. The sheets consist of a catatonically cured modified epoxy photoresist between two throw-away layers of protective polyester film (PET). The epoxy photoresist formulation contains an antimony-free photoacid generator and is prepared under a highly controlled solvent-less process, which provides uniform coatings. The solvent developed negative working photoresist is sensitive to UV radiation in the range of 350 – 395nm.
SUEX is compatible with and exhibits good adhesion to silicon, silicon nitride, copper, gold, aluminium, glass, polymers, other metals and oxides.
Manufacturers:
