AUROLECTROLESSTM SMT 525G Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.
Pack Sizes and Applications:
- Wire bonding
- Easy to control and has a high tolerance to contaminants
- Lower operating costs thanks to reduced gold content
- It is free of chelates such as EDTA, making it an environmentally-friendly option
- It offers excellent solderability