COPPER GLEAM™ HS-200
COPPER GLEAM™ HS-200 is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode.
- COPPER GLEAM™ HS-200 is formulated for high current density plating
- Its process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times
- It has exceptional physical qualities
- Operators can be assured of complete analytical control during the process