KMSF® 2000
KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for high reliability heterogeneous design in advanced packaging.
Material Features:
- It provides a unique advantage offering through its improved pattern resolution
- KMSF 2000 is a low-temperature cure
- It offers a robust balance of mechanical and electrical properties
- It is designed for an optimal cured film thickness of 5-10 μm
Manufacturer:
