An advanced thick photoresist designed for processing Mid-Critical and BEOL features, with a very high throughput for mid-thick and thick applications.
Pack Sizes and Applications:
- Line/Space and Trench
- Substrates including Silicon, Silicon-Dioxide, Nitride (SiN) and reflective Polysilicon/Metal
- It performs well in a wide range of applications and substrates, including Line/Space and Trench applications from 1-50um feature sizes.
- Offers good resolution and very good feature profiles in Line/Space and Trench applications
- Achieves a very high aspect ratio
- Performs well with DryEtch, Wet Etch and Implant processes
- Can be used as a consolidation photoresist
- Its product family is PFOS/PFOA free